Toshiba Electronic Devices & Storage Corporation ("Toshiba") has launched three 100 V N-channel power MOSFET products that help to reduce the size of automotive equipment and expanded the lineup.
The new products are “XPW4R10ANB” using the DSOP Advance(WF)L package, “XPW6R30ANB” using the DSOP Advance(WF)M package, and “XPN1300ANC” using the TSON Advance(WF) package. These are Toshiba’s first 100 V products using these packages. The packages have a wettable flank terminal structure, which facilitates automated on-board visual inspection. And they conform to AEC-Q101, a reliability standard for automotive applications. In addition, they are low On-resistance products using U-MOSVIII-H process, helping reduction of the power consumption of equipment.
They can be used for various automotive equipment applications, meeting a wide range of customer needs.
Low On-resistance :
RDS(ON)=3.4 m? (typ.) @VGS=10 V (XPW4R10ANB)
RDS(ON)=5.3 m? (typ.) @VGS=10 V (XPW6R30ANB)
RDS(ON)=11.2 m? (typ.) @VGS=10 V (XPN1300ANC)
Surface mount type packages with a wettable flank terminal structure, which facilitates automated visual inspection of board mounting conditions.