Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has launched the “TLP5751H,” “TLP5752H” and “TLP5754H” which are photocoupler products using the SO6L package that can isolate drive gates of IGBTs and MOSFETs with small to medium capacity.
The new products have increased their operating temperature (max) from the 110 °C of existing products[1] to 125 °C. The major characteristics have also been specified with the operating temperature ratings (Ta=-40 to +125 °C), making it easier to design and maintain a temperature margin.
The package is slim with a maximum height of 2.3 mm, helping to improve the flexibility in the layout of parts on a system board. In addition, the package can be mounted on the land pattern for our conventional products[2] using the SDIP6 package[3]. Therefore, the products can be mounted on the back side of a board or where height is limited, replacing conventional products.